Full-Time Experience

ElectroMechanical Engineer | Lockheed Martin

June 2020 - April 2022

I worked as a part of Electronics Packaging where I primarily designed electronic packages for missile and satellite applications.

Iterated Standard Board Outlines to integrate EE-designed PCBs and assembly interfaces.
Utilized GD&T in accordance with ASME Y14.5 to create drawings in Creo for procurement.
Conducted stress analysis on a circuit-card-assemblies using NX to validate flight survivability.
Achieved Employee of the Month after working 4 months full-time for an innovative package design

As an example of the type of products I designed, I've pictured a generic electronics package product (see 1st image). The engineering detail that goes into designing a product like this is as follows:

Create traceable command media to communicate with Electrical Engineers
- I created Standard Board Outlines (SBOs - see 2nd image) and Interface Control Drawings (ICDs) to highlight keep-out zones for mechanical fixture mounting locations, connector routing placements, large FPGAs or SoCs, and heat sinks to the electrical design team.
- Often an iterative process as new electrical, thermal, or design requirements came to light from systems engineering or management
Geometric Dimensioning and Tolerance (GD&T) is critical in drawing creation when designing packages, especially in the following scenarios:
- Connector placement and connector panel matchup are critical to designing properly to prevent EMI leakage and protect electrical components
- Wedgelock usage to mount the circuit card assemblies to the chassis
- Higher assembly mounting and integration
- General surface finishes, flatness requirements, profile tolerances, hole size, hole locations, etc.
Perform stress analysis using NX and hand calculations to validate survivability given Power Spectral Densities (Vibration Conditions) during flight. I did this in two ways:
- Von Mises Stress Analysis validated using NX simulation (see 3rd image). Conditions were generally set up as follows:
  1. Simplify the geometry of assembly (holes, chamfers, and subtle complex geometry are often negligible)
  2. Create a 3D mesh of the assembly, size a tradeoff between accuracy and run time
  3. Model mate bolt as a very stiff spring. Join surfaces using rigid body elements (RBE2) and spring elements (CBUSH)
  4. Define fixed, glued, and other miscellaneous elements
- Dynamic Fatigue Analysis - Focused on Electronic Components
  1. Investigate problematic parts by scraping through data sheets to get part dimensions and lead mounting methods (flatpack, SMD, BGA, etc.)
  2. Calculate max deflection at launch frequencies (proprietary methods) and evaluate if additional securing methods are required to reduce deflection (jumper cables, pastes, adhesives, etc.)
Perform trade studies to evaluate design decisions to select the best path forward. I traded:
- PCB communication configurations: Flex PCBs, Stacked Connector PCBs, Slotted PCBs into a motherboard, orientation, etc.
- Input and Outputs (IOs): Connector choice, pin count, and connector location

Industry Guided Experience

Hardware Product Sprint Associate | Google

June 2019 - August 2019

I was 1 of 20 students selected for Google's 12-week part-time remote developmental program in consumer electronics. This program allowed me to:

Strengthened my proficiency in mechanical design skills, including initial concept development, engineering design, prototyping, and device assembly
Created a Smart Product by designing a plastic enclosure using OnShape, a CAD Software, to support the internal components of Google’s AIY voice kit aimed to increase the user's happiness and motivation
Completed a fit check assembly of the device using 3D-printed enclosures
Attend “EVT week” at Google HQ in Mountain View, CA to assemble, build, and present final product & design review to Google hardware engineers and the HPS community

CAD Design

Iterated a CAD Design to have Raspberry Pi mounts, speaker mounts, and a slot for connector saver. Included a soft mat adhered bottom for grip and concealing of fasteners.

3D Printed Prototype

Initial prototype print using PLA and transparent ABS material for custom LED configurations.

EVT Week Presentation

Presented final design to a team of Google employees at the Mountain View Campus.

Full-Time Engineering Internships

Tooling Design Intern | Apple

May 2022 - August 2022

Worked as a tooling design engineer to create aids in display manufacturing:

Shadowed process for a new manufacturing technique to innovate ways to improve the process through fixture design
Iterated a complex assembly rig to aid in manufacturing R&D Displays
Improved the design regularly per feedback from customer
Conducted trade studies of vendor's options for procurement
Developed a test plan and collected data for verification of improvement on a display manufacturing process

Flight Controls Intern | Boeing

June 2019 - September 2019

I supported the Autoflight Navigation and Controls division responsible for ensuring the quality of Autopilot, Auto-throttle, and Flight Director controls on the 737, 747, 767, 777, and 787. The focus, however, was on aiding the 737 MAX return to service. I assisted in:

Editing control circuit diagrams to effectively communicate revisions in MCAS control software
Revising the 737 GPS autoland system to optimize processor in-flight computing power
Investigating customer requests reporting unusual autoflight behavior to assess if proper action needs to be taken

Mechanical Engineering Intern | GE Aviation

June 2018 - August 2018

I supported the Marine and Industrial Performance team which spearheaded the development of adapting GE flight engines to power generation applications. Specifically, I worked on the development of the GE90-adapted LM9000. Tasks I worked on include:

Utilizing a tool called NPSS, a C-based engine performance tool, to run redline and engine limit testing.
Generating customer data access requests using the current working engine cycle steady-state model.
Updating the steady-state model as developing information became available to prepare for the upcoming First Engine To Test.

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